Leeson Micro Series Compact Inverters Bedienungsanleitung PDF herunterladen (Seite 24)

7.0 INSTALLATION

 DRIVESMUSTNOTBEINSTALLEDWHERESUBJECTEDTO ADVERSE ENVI-

RONMENTAL CONDITIONS! DRIVES MUST NOT BE INSTALLED WHERE

SUBJECTED TO: COMBUSTIBLE, OILY, OR HAZARDOUS VAPORS OR DUST;

EXCESSIVE MOISTURE OR DIRT; STRONG VIBRATION; EXCESSIVE AMBIENT

TEMPERATURES. CONSULT LEESON FOR MORE INFORMATION ON THE

SUITABILITY OF A DRIVE TO A PARTICULAR ENVIRONMENT.

The drive should be mounted on a smooth vertical surface capable of safely supporting the unit without

vibrating. The LCD display has an optimum field of view, this should be considered when determining the

mounting position.

Chassis models must be installed in an electrical enclosure which will provide complete mechanical

protectionand maintainuniforminternal temperaturewithin thedrive’sambientoperatingtemperature

rating.AlldrivemodelsMUSTbemountedinaverticalpositionforproperheatsinkcooling.

Maintain a minimum spacing around the drive as follows:

 Ifitisnecessarytodrillorcutthedriveenclosureorpanel,extremecaremustbetakentoavoiddamaging

drive components or contaminating the drive with metal fragments (which cause shorting of electrical

circuits). Cover drive components with a clean cloth to keep out metal chips and other debris. Use a

vacuum cleaner to clean drive components after drilling, even if chips do not appear to be present. Do not

attempt to use positive air pressure to blow chips out of drive, as this tends to lodge debris under electronic

components. Contaminating the drive with metal chips can cause drive failure and will void the warranty.

 All drivemodels MUST bemounted inavertical positionforproper heatsinkcooling. Fans orblowers

shouldbe usedtoinsurepropercooling intight quarters.Do not mount drives above other drives or

heat producing equipment that would impede the cooling of the drive. Note the ambient operating

temperature ratings for each drive model.

 Ifitisnecessarytodrillorcutthedriveenclosureorpanel,extremecaremustbetakentoavoiddamaging

drive components or contaminating the drive with metal fragments (which cause shorting of electrical

circuits). Cover drive components with a clean cloth to keep out metal chips and other debris. Use a

vacuum cleaner to clean drive components after drilling, even if chips do not appear to be present. Do

not attempt to use positive air pressure to blow chips out of drive, as this tends to lodge debris under

electronic components. Contaminating the drive with metal chips can cause drive failure and will void the

warranty. The MICRO Series is UL approved for solid state motor overload protection. Therefore, a

separatethermaloverloadrelayisnotrequiredforsinglemotorapplications.Inapplicationswhereonedrive

isoperatingmorethanonemotor,aseparatethermaloverloadrelayisrequiredforeachmotorperNEC.

WARNING

SPACING REQUIREMENTS

SPACING

HP INCHES mm

0.25 - 5 2 50

7.5 - 25 4 100

30 - 60 6 150

75 - 150 8 200

1 2 ... 19 20 21 22 23 24 25 26 27 28 29 ... 91 92

Keine Kommentare

Leeson Micro Series Compact Inverters Bedienungsanleitung Seite 24